Figure 3.10: C-V curves for a pMOSFET: The shape of the C-V curves in Fig-
ure 3.10 changes during stress and recovery. From these changes the information about the defects at different energy levels contributing to degradation and recovery as well as
about and
can be extracted.
In addition to the CP method, the C-V method allows for an energetic profiling of defects as well. The C-V technique was introduced
in 1960 in order to determine the majority carrier concentration in semiconductors [113]. Meanwhile, this method is also used for tracking the and
shifts in MOSFETs due to previously applied stress [114, 115]. As shown schematically in Figure 3.8, the basic experimental setup can be realized by the application of a
bulk voltage (
) at the drain, bulk and source contacts
and a simultaneous measurement of the
. The applied
signal is a superposition of a DC offset,
which drives the MOSFET from accumulation to inversion, and a small AC component with an amplitude typically around 50 mV. Due to the gate capacitance (
), the simultaneously measured
is phase-shifted as illustrated in
Figure 3.9. Using an equivalent circuit diagram
can be calculated from the
and
signals.
Typical curves of with respect to the DC offset of
are shown in Figure 3.10. When sweeping the DC component from accumulation to inversion, a depletion layer near the substrate/oxide interface forms because the majority carriers are forced away into the
substrate. The remaining fixed ionized acceptors or donors build up a depletion charge and reduce the total gate capacitance. As soon as the minority carriers at the interface exceed the majority carriers and an inversion layer is
created, the gate capacitance increases again. From the change of the C-V shape in Figure 3.10 during stress and recovery phases, the different
energy levels contributing to degradation and recovery as well as
and
can be extracted. This allows for a
thorough characterization of degradation mechanisms like BTI and HCD.